HTS

Silicone Heat Transfer Compound

Silicone Heat Transfer Compound is a metal oxide filled silicone oil providing an extremely efficient and exceptionally thermally conductive compound which will operate over a wide temperature range.

HTC

Non-Silicone Thermal Interface Material

Electrolube Heat Transfer Compound is recommended where the efficient and reliable thermal coupling of electrical and electronic components is required.

HTCP

Non-Silicone Heat Transfer Compound Plus

HTCP provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil.

GP300

Thermal Gap Pad

GP300 is a silicone based thermal interface gap pad designed for easy application and good thermal conductivity.

HTCX

Non-Silicone Thermal Interface Material

Electrolube HTCX is an enhanced version of HTC featuring improved thermal conductivity, lower oil bleed, and lower evaporation weight loss.

HTCPX

Thermal Gap Filler

HTCPX provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil.

HTCX

Non-Silicone Thermal Interface Material

Electrolube HTCX is an enhanced version of HTC featuring improved thermal conductivity, lower oil bleed, and lower evaporation weight loss.

HTCX_ZF

Non-Silicone Thermal Interface Material

HTCX_ZF is a Zinc Oxide free version of Electrolube's highly successful Heat Transfer Compound Xtra (HTCX).

GP500

Thermal Gap Pad

GP500 is a specialist silicone based thermal interface gap pad designed specifically to exhibit a very low thermal resistance value.

TCP400

Thermally Conductive Putty

TCP400 is a single part dispensable material with high heat transfer performance.