Make it with our expertise
The telecommunications sector continues to be at the epicentre for growth, innovation, and disruption for virtually any industry. Mobile devices and related broadband connectivity continue to be more and more embedded in the fabric of society today and they are key in driving the momentum around some key trends such as video streaming, Internet of Things (IoT), and mobile payments. As a sector, there is a definite drive towards increasingly complex PCB designs and miniaturisation as we see smaller and lighter weight devices emerging.
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Conformal
Coatings -
Encapsulation
Resins -
Thermal
Management -
Contact
Lubricants -
Electronic
& General Cleaning -
Maintenance
& Service Aids
- Antennas
- Wireless Receivers / Transmitters
- GPS systems + Radar
- Communication Exchanges
- Mobile Communication
- Internet of Things (IoT)
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Make it our problem
Conformal Coatings and Encapsulation Resin materials are used for a wide variety of applications within the telecommunications industry, offering a variety of protection levels for electronic devices. Coatings and resins form vital protective barriers to sensitive electronics and ultimately ensure the reliability and lifetime of the device. To give an example, uncoated circuit boards are vulnerable to corrosion, electro-chemical migration and current leakage. Ultimately, this will inevitably result in poor performance and product failure.
Telecommunications as an industry also has a requirement for RFI/EMI Shielding Products as they can maximise functionality of devices and prevent cross-interference with other devices. Their use in this sector includes telephone systems, mobile phones, GPS systems, satellite dishes, in-flight ‘phone systems, satellites, radar, Ethernet connections, high speed routers, switches, optical networks, composite patch panels and antennas.
Problem
Mobile Phone Waterproofing
Requirement to protect the electronics within a mobile phone should the phone be immersed in water for very short periods of time. The protection required should be minimal to prevent ingress of water into the board and components and should also be very fast to process.
Solution
FPC was provided as it fit both requirements of the customer. The low surface energy provided by the FPC coating ensured that water would run off the board or form beads on the surface until the angle of the board was such that the water would escape quickly. In addition, the coating provided some resistance to the water, protecting the electronics until they were dried out again. FPC is suitable for dip coating processes and has a very quick evaporation rate, ensuring suitability for high throughput applications.
FPC
Fluorinated Polymer Conformal Coating
Problem
Antenna Protection
Customer was trying to pot a Bluetooth antenna to protect from external environmental conditions, however, they were experiencing issues with a loss of signal. After trying several resins from various sources, they came to Electrolube for help in understanding the issue.
Solution
UR5118 was the chosen resin due to its low dielectric constant and excellent protection in a variety of external conditions. Initially, the resin failed the customer tests as well, again due to a loss of signal. Experts from Electrolube’s Technical Support Team looked into the application with the customer and identified that their choice of variant of the particular antenna used was not compatible with any encapsulation compounds. The same antenna was available in an alternative form and this worked well when potted, meeting the customer requirements when using UR5118.
UR5118
Highly Water Resistant, RF Polyurethane Resin
Problem
IOT - Heating Controls
Customer had temperature sensors in their heating control systems and needed to improve the heat transfer to ensure the sensors were reading accurately. The product should stay in place and also offer some bonding capability to ensure that no migration of the material was possible. This was important to ensure there was no interference with the information transmitted from the device.
Solution
TCOR was offered due to its good bond strength and high thermal conductivity. By removing air from around the temperature sensor and bonding in place with a thermally conductive material, heat transfer was improved as was the accuracy of the device.
TCOR
RTV Thermally Conductive Oxime
Make it with a tailored solution
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