ER2074
Thermally Conductive Epoxy Resin
ER2074
Thermally Conductive Epoxy Resin
ER2074 is a flame retardant system two component epoxy resin with UL94 V-0 approval with high thermal conductivity value of 1.26W/m.K.
ER2074
Thermally Conductive Epoxy Resin
ER2074
Thermally Conductive Epoxy Resin
ER2074 is a flame retardant system two component epoxy resin with UL94 V-0 approval with high thermal conductivity value of 1.26W/m.K.
ER2221
Thermally Conductive Epoxy Potting Compound
ER2221
Thermally Conductive Epoxy Potting Compound
ER2221 resin has been formulated as high temperature resistant and thermally conductive potting compound which retains excellent characteristics throughout thermal cycling. ER2221 is coloured black.
ER2220
Highly Thermally Conductive Epoxy Potting Compound
ER2220
Highly Thermally Conductive Epoxy Potting Compound
ER2220 is a flame retardant, thermally conductive epoxy encapsulation resin which combines ease of processing with an enhanced thermal conductivity.
ER2183
Thermally Conductive Epoxy Potting Compound
ER2183
Thermally Conductive Epoxy Potting Compound
ER2183 is a thermally conductive epoxy resin meets UL94 flame retardancy using clean technology which results in relatively low toxicity fumes and low smoke emission.
GF400
Thermal Gap Filler
GF400
Thermal Gap Filler
GF400 is a two part, liquid silicone based gap filler, which provides excellent thermal performance.
GF400
Thermal Gap Filler
GF400
Thermal Gap Filler
GF400 is a two part, liquid silicone based gap filler, which provides excellent thermal performance.
HTSP
Silicone Heat Transfer Compound Plus
HTSP
Silicone Heat Transfer Compound Plus
HTSP provides the ultimate in thermal conductivity together with the very wide temperature range obtained by using silicone base oils.
HTSX
Silicone Heat Transfer Compound Xtra
HTSX
Silicone Heat Transfer Compound Xtra
HTSX is a silicone thermal interface material which has been developed to perform in more extreme conditions than its sister product HTS.
TBS
Thermal Bonding System
TBS
Thermal Bonding System
Thermal Bonding System is a two part epoxy bonding system which utilises metal oxides to provide excellent thermal conductivity whilst being electrically insulating.
TCRGUN
Cartridge Application Gun
TCRGUN
Cartridge Application Gun
Electrolube cartridge application gun, suitable for TCOR and TCER.
TCOR
RTV Thermally Conductive Oxime
TCOR
RTV Thermally Conductive Oxime
TCOR Thermally Conductive Oxime is a single component, high thermal conductivity RTV for the effective bonding or gap filling in electronic devices.
HTC
Non-Silicone Thermal Interface Material
HTC
Non-Silicone Thermal Interface Material
Electrolube Heat Transfer Compound is recommended where the efficient and reliable thermal coupling of electrical and electronic components is required.
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