Compare Thermal Management Solutions Products
HTCPX Thermal Gap Filler 
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HTCPX Thermal Gap Filler
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HTCPX Thermal Gap Filler
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Type 
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| Silicone | ||||
| Non-silicone |
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Cure / Bonding
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| Yes | ||||
| No |
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Interface / Gap Filling / Encapsulation
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| Interface | ||||
| Gap filling |
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| Encapsulation | ||||
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Viscosity (Pa.s)
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| Viscosity Max | 670 | |||
| Viscosity Min | 606 | |||
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Thermal Conductivity (W/m.K)
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| Thermal Conductivity (W/m.K) | 3.40 | |||
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Temperature (°C)
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| Min Temperature | -50 | |||
| Max Temperature | 180 | |||
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Electrically insulating
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| Yes |
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| No | ||||
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Density (g/mL)
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| Density (g/mL) | 3.10 | |||
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Flame retardency
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| Yes |
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| No | ||||
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Application method
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| Screen printing | ||||
| Auto/Manual Dispensing |
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| Gap pad | ||||
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