TBS
Thermal Bonding System
TBS
Thermal Bonding System
Thermal Bonding System is a two part epoxy bonding system which utilises metal oxides to provide excellent thermal conductivity whilst being electrically insulating.
TBS
Thermal Bonding System
TBS
Thermal Bonding System
Thermal Bonding System is a two part epoxy bonding system which utilises metal oxides to provide excellent thermal conductivity whilst being electrically insulating.
TCRGUN
Cartridge Application Gun
TCRGUN
Cartridge Application Gun
Electrolube cartridge application gun, suitable for TCOR and TCER.
TCOR
RTV Thermally Conductive Oxime
TCOR
RTV Thermally Conductive Oxime
TCOR Thermally Conductive Oxime is a single component, high thermal conductivity RTV for the effective bonding or gap filling in electronic devices.
HTCX_ZF
Non-Silicone Thermal Interface Material
HTCX_ZF
Non-Silicone Thermal Interface Material
HTCX_ZF is a Zinc Oxide free version of Electrolube's highly successful Heat Transfer Compound Xtra (HTCX).
HTS
Silicone Heat Transfer Compound
HTS
Silicone Heat Transfer Compound
Silicone Heat Transfer Compound is a metal oxide filled silicone oil providing an extremely efficient and exceptionally thermally conductive compound which will operate over a wide temperature range.
HTC
Non-Silicone Thermal Interface Material
HTC
Non-Silicone Thermal Interface Material
Electrolube Heat Transfer Compound is recommended where the efficient and reliable thermal coupling of electrical and electronic components is required.
SC2001
Heat Cured Silicone Resin
SC2001
Heat Cured Silicone Resin
SC2001 is a two-part, general purpose potting and encapsulating compound designed for the protection for electronic devices. It has exceptional high temperature properties.
HTCP
Non-Silicone Heat Transfer Compound Plus
HTCP
Non-Silicone Heat Transfer Compound Plus
HTCP provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil.
OP9003
Resin Stripper
OP9003
Resin Stripper
OP9003 is a special non-flammable solvent blend designed to swell and soften cured epoxy, polyurethane and other resins and enable their removal from most substrates.
HTCX
Non-Silicone Thermal Interface Material
HTCX
Non-Silicone Thermal Interface Material
Electrolube HTCX is an enhanced version of HTC featuring improved thermal conductivity, lower oil bleed, and lower evaporation weight loss.
OP9004
Resin / Coating Machine Cleaner
OP9004
Resin / Coating Machine Cleaner
Resin and coating machine cleaner is a specialist blend designed to swell and soften cured epoxy or polyurethane resin as well as chemically resistant conformal coatings.
GP500
Thermal Gap Pad
GP500
Thermal Gap Pad
GP500 is a specialist silicone based thermal interface gap pad designed specifically to exhibit a very low thermal resistance value.
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