Compare Thermal Management Solutions Products
HTCX Non-Silicone Thermal Interface Material |
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HTCX Non-Silicone Thermal Interface Material |
HTCX Non-Silicone Thermal Interface Material |
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Type | ||||
Silicone | ||||
Non-silicone | ||||
Cure / Bonding | ||||
Yes | ||||
No | ||||
Interface / Gap Filling / Encapsulation | ||||
Interface | ||||
Gap filling | ||||
Encapsulation | ||||
Viscosity (Pa.s) | ||||
Viscosity Max | 141 | |||
Viscosity Min | 127 | |||
Thermal Conductivity (W/m.K) | ||||
Thermal Conductivity (W/m.K) | 1.35 | |||
Temperature (°C) | ||||
Min Temperature | -50 | |||
Max Temperature | 180 | |||
Electrically insulating | ||||
Yes | ||||
No | ||||
Density (g/mL) | ||||
Density (g/mL) | 2.61 | |||
Flame retardency | ||||
Yes | ||||
No | ||||
Application method | ||||
Screen printing | ||||
Auto/Manual Dispensing | ||||
Gap pad | ||||